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PULPDENT EMBRACE WETBOND PIT AND FISSURE SEALANT
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Description
Embrace WetBond Pit & Fissure Sealant
Fluoride Releasing · Light Cure · Radiopaque
Bonds to the moist tooth
Contains No Bisphenol A (BPA), No BIS-GMA, NO BIS-DMA
Unsurpassed 6-year clinical results: 99% Caries-Free
After 8 years dentists and hygienists agree: Best Sealant Ever
"It's an absolutely sensational product" - John D. Doykos III, DMD, MSD
"Moist field placement increases success and reduces frustration." - Peggy Yamagata, RDH, MED
"Virtually undetectable margins." - Dental Advisor 2004;21(8)
Bonds to the moist tooth
Contains No Bisphenol A (BPA), No BIS-GMA, NO BIS-DMA
Unsurpassed 6-year clinical results: 99% Caries-Free
After 8 years dentists and hygienists agree: Best Sealant Ever
"It's an absolutely sensational product" - John D. Doykos III, DMD, MSD
"Moist field placement increases success and reduces frustration." - Peggy Yamagata, RDH, MED
"Virtually undetectable margins." - Dental Advisor 2004;21(8)
Key Specifications
Fluoride Releasing, Light Cure, Radiopaque
Wet-Bonding - Moisture tolerant resin chemistry
Contains No Bisphenol A, No Bis-GMA, No Bis-DMA
Tooth Integrating - Seals against microleakage
Tech Info
Physical Properties
Physical Properties
Compressive strength: 34,800 (3,800) p.s.i.
Diametral tensile strength: 6,300 (725) p.s.i.
Percentage filler by weight: 36.6%
Film thickness: 12 microns
Diametral tensile strength: 6,300 (725) p.s.i.
Percentage filler by weight: 36.6%
Film thickness: 12 microns
Features
Contains No Bisphenol A, No Bis-GMA, No Bis-DMA
Wet-Bonding - Moisture tolerant resin chemistry
Tooth Integrating - Seals against microleakage
Margin-free - No chipping, pitting, or staining.
No Bonding Agents Required - Fewer steps - Saves time and money.
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